MBIR 3D Reconstruction Method Effectively Minimizes Missing Wedge Artifacts and Restores Missing Information in Cryo-electron Tomography
نویسندگان
چکیده
منابع مشابه
Compensation of Missing Wedge Effects with Sequential Statistical Reconstruction in Electron Tomography
Electron tomography (ET) of biological samples is used to study the organization and the structure of the whole cell and subcellular complexes in great detail. However, projections cannot be acquired over full tilt angle range with biological samples in electron microscopy. ET image reconstruction can be considered an ill-posed problem because of this missing information. This results in artifa...
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Cryo Electron Tomography (cryoET) plays an essential role in Structural Biology, as it allows us to study structure of large macromolecular complexes in their close to native environment in-situ. It is often combined with high-resolution protocols such as Subtomogram Averaging (SA) to obtain structures of individual complexes from the tomograms. For successful and fully automatic application of...
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A strategy to mitigate typical reconstruction artefacts in missing wedge computed tomography is presented. These artefacts appear as elongations of reconstructed details along the mean direction (i.e. the symmetry centre of the projections). Although absent in standard computed tomography applications, they are most prominent in advanced electron tomography and also in special topics of X-ray a...
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Quantitative electron tomography is proposed to characterize porous materials at a nanoscale. To achieve reliable three-dimensional (3D) quantitative information, the influence of missing wedge artifacts and segmentation methods is investigated. We are presenting the "Discrete Algebraic Reconstruction Algorithm" as the most adequate tomography method to measure porosity at the nanoscale. It pro...
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Since FIB was first introduced, one of the major applications has been to mill site-specific crosssectioned sample surfaces [1]. This approach not only allows SEM access to the structural information buried under the surface, but it is also the first step of making TEM lamellae using FIB. Importantly, there are many reports of beam-induced damage due to FIB processing. Here, we report on artifa...
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ژورنال
عنوان ژورنال: Microscopy and Microanalysis
سال: 2020
ISSN: 1431-9276,1435-8115
DOI: 10.1017/s143192762002396x